Gaya APA
Modeling and Application of Flexible Electronics Packaging. (2019).
New York:
Springer Science Business Media.
Gaya Chicago
Modeling and Application of Flexible Electronics Packaging.
.
New York:
Springer Science Business Media,
2019.
Text.
Gaya MLA
Modeling and Application of Flexible Electronics Packaging.
.
New York:
Springer Science Business Media,
2019.
Text.
Gaya Turabian
Modeling and Application of Flexible Electronics Packaging.
New York:
Springer Science Business Media,
2019.
Print.